Home / Products / Integrated Circuits (ICs) / Interface - Telecom / CYP15G0401DXB-BGI
Manufacturer Part Number | CYP15G0401DXB-BGI |
---|---|
Future Part Number | FT-CYP15G0401DXB-BGI |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | HOTlink II™ |
CYP15G0401DXB-BGI Status (Lifecycle) | In Stock |
Part Status | Obsolete |
Function | Transceiver |
Interface | LVTTL |
Number of Circuits | 4 |
Voltage - Supply | 3.135V ~ 3.465V |
Current - Supply | 830mA |
Power (Watts) | - |
Operating Temperature | -40°C ~ 85°C |
Mounting Type | Surface Mount |
Package / Case | 256-LBGA Exposed Pad |
Supplier Device Package | 256-BGA (27x27) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CYP15G0401DXB-BGI Weight | Contact Us |
Replacement Part Number | CYP15G0401DXB-BGI-FT |
DS21Q42T
Maxim Integrated
DS21Q42TN
Maxim Integrated
DS21Q43-ATN
Maxim Integrated
DS21Q43AT
Maxim Integrated
DS21Q44T
Maxim Integrated
MAX2982GCD/V+T
Maxim Integrated
DS2155GNC2+
Maxim Integrated
DS2155G+
Maxim Integrated
DS21352G
Maxim Integrated
DS21552G
Maxim Integrated
LCMXO2-1200HC-5TG144I
Lattice Semiconductor Corporation
LFEC1E-4T144I
Lattice Semiconductor Corporation
XCV405E-6FG676I
Xilinx Inc.
A3PE600-FG256I
Microsemi Corporation
5SGXEBBR2H43I2
Intel
M1A3P600-1FGG144I
Microsemi Corporation
LFE5U-45F-6BG256C
Lattice Semiconductor Corporation
EP1S60F1508C6N
Intel
EP2C8Q208C7
Intel
EP4SGX70HF35C3
Intel