Home / Products / Resistors / Through Hole Resistors / H4P56K2DCA
Manufacturer Part Number | H4P56K2DCA |
---|---|
Future Part Number | FT-H4P56K2DCA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Holco, Holsworthy |
H4P56K2DCA Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 56.2 kOhms |
Tolerance | ±0.5% |
Power (Watts) | 1W |
Composition | Metal Film |
Features | Pulse Withstanding |
Temperature Coefficient | ±50ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | Axial |
Supplier Device Package | Axial |
Size / Dimension | 0.146" Dia x 0.394" L (3.70mm x 10.00mm) |
Height - Seated (Max) | - |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
H4P56K2DCA Weight | Contact Us |
Replacement Part Number | H4P56K2DCA-FT |
H4P39RFZA
TE Connectivity Passive Product
H4P3K01DCA
TE Connectivity Passive Product
H4P3K01DZA
TE Connectivity Passive Product
H4P3K0DZA
TE Connectivity Passive Product
H4P3K0FCA
TE Connectivity Passive Product
H4P3K16DCA
TE Connectivity Passive Product
H4P3K16DZA
TE Connectivity Passive Product
H4P3K32DCA
TE Connectivity Passive Product
H4P3K32DZA
TE Connectivity Passive Product
H4P3K3FCA
TE Connectivity Passive Product
LCMXO2-640HC-6SG48I
Lattice Semiconductor Corporation
LCMXO640C-3TN100C
Lattice Semiconductor Corporation
XCV1600E-8FG900C
Xilinx Inc.
M1AFS600-FG484
Microsemi Corporation
A3PN030-Z2QNG48
Microsemi Corporation
AT40K05-2DQI
Microchip Technology
10M08SCU169I7G
Intel
10AX048K2F35I2SG
Intel
5SGXMA4H3F35I3LN
Intel
10AX115U2F45E2SG
Intel